12 inch Double Stations Semi-Automatic servo COG main-bonding Machine,LCM bonding machine, OLED IC main-bonding machineModel:CM008*PID Control Constrant Temp Heating System，Automatic temperature
12 inch Double Stations Semi-Automatic servo COG main-bonding Machine,LCM bonding machine, OLED IC main-bonding machine
| Model: | CM008 | *PID Control Constrant Temp Heating System，Automatic temperature compensation to ensure that the temperature of hot pressing is stable *Panasonic PLC Control system *Use high precision low-friction cylinder control pressure to ensure the accuracy of pressure control *High steel structure set, dual ceramic indenter configuration, to ensure the stability of the equipment *Imported electrical configuration， * for OLED high-end products，high quality，high successful rate。 |
| Product Name: | 1-12 inch Double Stations Semi-Automatic servo COG bonding Machine | |
| Suitable For: | Suitable for IC Bonded to the Panel， FOR OLED panel IC main-bonding, | |
| Size Range: | 1~12 inch | |
| Attach Precision: | ±4.5UM | |
| IC Size: | L:2~40mm，W:0.8~3mm | |
| Machine Capacity: | 600pcs/H | |
| Power Supply: | 220V±10%，50HZ,1200W | |
| Air Supply: | 0.5~0.7MPa,dry air | |
| Platform Size: | 150*100MM | |
| Platform Precision: | ±0.01MM | |
| Pressure Head Size: | L45*W5MM,customizable | |
| Temp Range: | RT~400℃ | |
| Time Range: | 0.1~99.9sec | |
| Product Size: | L640*W700*H1320MM | |
| Operate Height: | 800±10mm | |
| N.W: | About 320KG | |
| Packing Size: | ||
| G.W: |
