12 inch Double Stations Semi-Automatic servo COG main-bonding Machine,LCM bonding machine, OLED IC main-bonding machine

Model: | CM008 | *PID Control Constrant Temp Heating System,Automatic temperature compensation to ensure that the temperature of hot pressing is stable *Panasonic PLC Control system *Use high precision low-friction cylinder control pressure to ensure the accuracy of pressure control *High steel structure set, dual ceramic indenter configuration, to ensure the stability of the equipment *Imported electrical configuration, * for OLED high-end products,high quality,high successful rate。 |
Product Name: | 1-12 inch Double Stations Semi-Automatic servo COG bonding Machine |
Suitable For: | Suitable for IC Bonded to the Panel, FOR OLED panel IC main-bonding, |
Size Range: | 1~12 inch |
Attach Precision: | ±4.5UM |
IC Size: | L:2~40mm,W:0.8~3mm |
Machine Capacity: | 600pcs/H |
Power Supply: | 220V±10%,50HZ,1200W |
Air Supply: | 0.5~0.7MPa,dry air |
Platform Size: | 150*100MM |
Platform Precision: | ±0.01MM |
Pressure Head Size: | L45*W5MM,customizable |
Temp Range: | RT~400℃ |
Time Range: | 0.1~99.9sec |
Product Size: | L640*W700*H1320MM |
Operate Height: | 800±10mm |
N.W: | About 320KG |
Packing Size: |
|
G.W: |
|
