ACF胶带，ACF导电膜 ，ACF导电胶 AC-2056R-35
ACF Tape, ACF Film
ACF Tape is normally made up of two main components, namely Adhesive & conductive particles.
The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG), FOB, or any other configurations. It is specific to the application for which it is designed for.
ACF Conductive Particles
Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5μm to 30μm in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.
ACF Anisotropic Conductive Film
ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.
ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).
The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.
ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.
ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.
During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.
Conductives particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.
This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).
The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.
As the epoxy cures and conductive particles are trapped into permanent compressed form.
The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.
ACF has for many years, been used in glass display applications. Recently, it is also becoming widely used in COF and COB areas.
Examples of ACF applications.
- TAB Bonding (TCP-PCB / TCP-LCD)
- COG Bonding (IC-LCD)
- COB Bonding (IC-PCB)
- COF Bonding (IC-FPC)
- Plasma Display (FPC-PDP)
- Flip Chip Package
What is ACF?
1, The common explanation:
ACF is anisotropic conductive film, a kind of material in the bonding process to be used in capacitive screen, resistive screen, touch screen, LCD screen, tablet PC, mobile phone screens, etc.Means a resin film containing a heat-conductive particles of a thermoplastic or cured. Mainly for LCD panel signal transmission link with the driver IC, the need to bonding different interface to choose suitable conductive particles and density, generally used for fine pitch of the conductive particles having a diameter of about 3 ~ 5 um.
2, Professional explanation:
The English abbreviation of ACF is Anisotropic Conductive Film, ACF is the electrical conduction in the Z-axis direction and the XY insulation resistance characteristic plane has obvious differences. When the difference between Z-axis and the XY plane on-resistance value of the insulation resistance exceeds a predetermined ratio, also can be called well anisotropic conductivity.
What is ACF Equipment?
1, The popular explanation:
ACF device is also called "ACF attached machine", "ACF preloading machine", "ACF state machine", USE heat pipe heating mode, half cylinder to push the blade to cut off the ACF protection from type membrane, cylinder from viscose mold plastic, according to the ACF and different models to choose corresponding attached time, output value, corresponding to the pressure head cylinder according to the attached with a length of stepper motor feed, the ACF stickers on LCD (LCD), touch screen glass (TP), a FILM on the SENSOR.FOG is mainly used in LCD module, touch screen, COG in the process of production and maintenance of FPC, COF package, TAB, IC and LCD and PCB combination states.ACF attached machine is divided into semi-automatic and fully automatic, semi-automatic which requires human to cooperate to complete, fully automated equipment to complete the process by itself.ACF attached machine has single period and several attached machine .ACF attached machine is suitable for the card of various width of ACF in TP, or PCB, LCD, used in the TAB, COG LCD module production or high density FPC connection with the PCB.
2, Professional explanation:
ACF is Anisotropic Conductive Film, the guide Film), ACF bonding technology is to use the ACF, directional Conductive Film), IC, or integrated circuit by preloading depended on the LCD glass substrate. If you want to make the IC, or integrated circuit between the glass and well connected with the line, you need to through the integrated circuit and tiny MARK point on the glass substrate, very accurate positioning. The current way of positioning are mainly by installing on the device's camera and monitor, the human eye to find a place to MARK, and manually adjust the slider position, complete orientation.