Item Parameter Item Parameter Glass size range 7 ”~ 17”(16:9) Glass thickness range Min 0.2mm, Max 1.1mm IC size Min.5.0×0.8,Max.35×4 IC Bonding Number 1-6 pieces/2 types Attaching accuracy X±0.15mm,Y±0.15mm Total bonding accuracy…
Read more ADD TO INQUIRYItem Parameter Item Parameter Glass size range 7“ ~17“(16:9) Glass thickness range Min 0.2mm, Max 1.1mm Process cycle 9S wiping speed of 12 inches and 80mm/s on both sides Number of wiping edges…
Read more ADD TO INQUIRYItem Parameter Item Parameter Glass size range 1 ”~ 7”(16:9) Glass thickness range Min 0.2mm, Max 1.1mm FPC size Min.5.0×0.8,Max.35×4,LMAX.100mm FPC Bonding Number Unilateral single pill Attaching accuracy X±0.15mm,Y±0.15mm Total bonding accuracy…
Read more ADD TO INQUIRYOverview: This device is a small-scale fully automatic COG (chip on glass), compatible with COF and COP bonding machines, achieving the full process of ACF attachment, IC pre bonding, and IC main bonding…
Read more ADD TO INQUIRYOverview: This is a fully automatic COF punching and cutting machine, which uses a private server motor+ratchet drive, and a motor+belt tension mechanism to achieve automatic feeding. Adopting CCD visual positioning, high-precision punching…
Read more ADD TO INQUIRYEquipment Usage: Suitable for small-sized TFT, IPS, OLED LCD and other products, achieving LCD bonding terminal cleaning and plasma cleaning, automatic ACF attachment, alignment, pre-bonding, and main-bonding of single sided single chip…
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Characteristic: 1. Fast heating speed, low power consumption, and long service life; 2. Heating plate with uniform temperature, corrosion resistance, and high strength; 3. Wide voltage operation; 4. Wide range of constant temperature:…
Read more ADD TO INQUIRYCharacteristic: 1. Integrating multiple functions, integrating IC disassembly and FPC disassembly; 2. The disassembly accuracy is high, which can effectively ensure that the disassembled IC is not damaged and does not damage…
Read more ADD TO INQUIRYCharacteristic: 1. Adopting high accuracy guide rails to ensure the stability of the disassembly process 2. The disassembly accuracy is high, which can effectively ensure that the disassembled IC is not…
Read more ADD TO INQUIRYCharacteristic: 1. Wide measurement range: 0-1000N; 2. Measurement accuracy high: 0.1N, sampling period 0.2s; 3. Digital display for easy reading; 4. The equipment automatically lifts and can adjust the speed;
Read more ADD TO INQUIRYCharacteristic: 1. Wide measurement range: 0-1000N; 2. Measurement accuracy high: 0.1N, sampling period 0.2s; 3. Handheld compact and convenient, with easy digital display for reading; 4. Can display the peak pressure;
Read more ADD TO INQUIRYCharacteristic: 1. Wide measurement range: room temperature~1372 ℃; 2. Measurement accuracy high: 0.3 ℃, sampling cycle 0.5s; 3. Handheld compact and convenient, with easy digital display for reading; 4. Energy saving: 1…
Read more ADD TO INQUIRYCharacteristic: 1. Rich observation methods to meet your detection needs: bright field observation, dark field observation, simple polarized light observation, DIC differential interference observation, etc; 2. When using a strong halogen light source…
Read more ADD TO INQUIRYCharacteristic: 1. This device belongs to a metallographic microscope; The light source is falling light. The machine can be connected to an industrial camera to achieve the effect of taking photos and measuring.…
Read more ADD TO INQUIRYTechnical Parameters: LCD SIZE: 15~65inch Capacity: 100~250 segments/H Laminating speed 15mm/S~100mm/S Working air pressure: 0.4~0.6Mpa; Power Supply: 220V,50HZ,1200W; Total weight: About250Kg; Dimensions: L2080*W1250*H1080;
Read more ADD TO INQUIRYTechnical Parameters: LCD SIZE: 15~65inch Capacity: 100~250 segments/H Tearing method Manually tear open one corner and start tearing Tear speed 15mm/S~100mm/S Heating method: Constant temperature heating; Temperature range: RT-150℃; Working air pressure:…
Read more ADD TO INQUIRYCharacteristic: 1. Adopting a high accuracy imaging unit, the amplification bit is increased to nearly 150 times; 2. Add manual room temperature Pre Bonding function to solve COF bending problem; 3. The use…
Read more ADD TO INQUIRYCharacteristic: 1. Adopting a high accuracy imaging unit, the amplification bit is increased to nearly 150 times; 2. Add manual room temperature Pre Bonding function to solve COF bending problem; 3. The use…
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