This equipment is an offline COG automatic maintenance machine. The equipment manually installs materials (such as ACF, COF/IC, and buffer materials), starts the equipment, and places the glass that needs to be repaired on the glass platform (the bonding position has been cleaned). The equipment automatically completes ACF attachment, IC alignment, IC Pre Bonding, and IC Main Bonding at the set position. After all processes are completed, the platform exits to the loading position.

Usage：

This device is suitable for COF/FPC bonding of medium size hard glass display screens, as well as bonding of back opaque products such as Mini backlight, ON Cell, etc.